New courses in Materials Science and Engineeringhttp://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/index.htm2008-09-04MIT OpenCourseWare http://ocw.mit.eduen-USContent within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/OcwWeb/web/terms/terms/index.htmElectrical, optical, magnetic, and mechanical properties of metals, semiconductors, ceramics and polymers. Discussion of roles of bonding, structure (crystalline, defect, energy band and microstructure) and composition in influencing and controlling physical properties. Case studies drawn from a variety of applications including semiconductor diodes, optical detectors, sensors, thin films, biomaterials, composites, and cellular materials.http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-225Fall-2007/CourseHome/index.htmFitzgerald, EugeneGibson, Lorna2008-08-01T12:39:50-04:003.225en-USMaterials Science and EngineeringPolymer Chemistrymaterials selectionfractureplasticityviscoelasticitypolaritymagnetismcellular materialsbiomaterialsthin filmssensorsoptical detectorssemiconductor diodescompositionmicrostructureenergy bandstructurebondingpolymersceramicssemiconductorsmetalsMIT OpenCourseWare http://ocw.mit.eduContent within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/OcwWeb/web/terms/terms/index.htmThe physics of microelectronic semiconductor devices for silicon integrated circuit applications. Topics: semiconductor fundamentals, p-n junction, metal-oxide semiconductor structure, metal-semiconductor junction, MOS field-effect transistor, and bipolar junction transistor. Emphasis on physical understanding of device operation through energy band diagrams and short-channel MOSFET device design. Issues in modern device scaling outlined. Includes device characterization projects and device design project.http://ocw.mit.edu/OcwWeb/Electrical-Engineering-and-Computer-Science/6-720JSpring-2007/CourseHome/index.htmAlamo, Jesus DelTuller, Harry2008-07-21T11:04:41-04:006.720J3.43Jen-USElectrical Engineering and Computer ScienceElectrical, Electronics and Communications Engineeringdevice designdevice characterizationshort-channel MOSFETenergy band diagrambipolar junction transistorMOS field-effect transistormetal-semiconductor junctionmetal-oxide semiconductor structurep-n junctionsemiconductorcircuitsiliconphysicsintegrated microelectronic devicesMaterials Science and EngineeringMIT OpenCourseWare http://ocw.mit.eduContent within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/OcwWeb/web/terms/terms/index.htmTV programs such as "Law and Order" show how forensic experts are called upon to give testimony that often determines the outcome of court cases. Engineers are one class of expert who can help display evidence in a new light to solve cases. In this seminar you will be part of the problem-solving process, working through both previously solved and unsolved cases. Each week we will investigate cases, from the facts that make up each side to the potential evidence we can use as engineers to expose culprits. The cases range from disintegrating airplane engines to gas main explosions to Mafia murders. This seminar will be full of discussions about the cases and creative approaches to reaching the solutions. The approach is hands-on so you will have a chance to participate in the process, not simply study it. Some background reading and oral presentation are required.http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-A27Fall-2007/CourseHome/index.htmRussell, KennethSedransk, Kyra2008-05-06T02:41:31-04:003.A27en-USMaterials Science and EngineeringWelding Technology/Welderfatigueoxidationcorrosionweldingbrazingsolderingcatastrophic failurealuminumstainless steelseminarfracturefailurecase studiesMIT OpenCourseWare http://ocw.mit.eduContent within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/OcwWeb/web/terms/terms/index.htmHere we will learn about the mechanical behavior of structures and materials, from the continuum description of properties to the atomistic and molecular mechanisms that confer those properties to all materials. We will cover elastic and plastic deformation, creep, and fracture of materials including crystalline and amorphous metals, ceramics, and (bio)polymers, and will focus on the design and processing of materials from the atomic to the macroscale to achieve desired mechanical behavior. Integrated laboratories provide the opportunity to explore these concepts through hands-on experiments including instrumentation of pressure vessels, visualization of atomistic deformation in bubble rafts; nanoindentation, and uniaxial mechanical testing; as well as writing assignments to communicate these findings to either general scientific or nontechnical audiences. http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-032Fall-2007/CourseHome/index.htmvan Vliet, KrystynVander Sande, John2008-04-17T12:40:47-04:003.032en-USMaterials Science and EngineeringMaterials Scienceatomic force microscopy and nanoindentation.bubble raft modelsand ancient materials. Lab experiments and demonstrations give hands-on experience of the physical concepts at a variety of length scales. Use of facilities for measuring mechanical properties including standard mechanical testsresidual stresses in thin filmsstress shielding in biomedical implantsplasticity and fracture. Case studies include materials selection for bicycle frameselasticitystress transformationstress-strain relationshipsBasic concepts of solid mechanics and mechanical behavior of materialsMIT OpenCourseWare http://ocw.mit.eduContent within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/OcwWeb/web/terms/terms/index.htmThe electrical, optical, transport, and mechanical properties of polymers are presented with respect to the underlying physics and physical chemistry of polymers in melt, solution, and solid state. Topics include conformation and molecular dimensions of polymer chains in solutions, melts, blends, and block copolymers. Examination of the structure of glassy, crystalline, and rubbery elastic states of polymers; thermodynamics of polymer solutions and blends, and crystallization; liquid crystallinity, microphase separation, and self-assembled systems. Case studies of relationships between structure and function in technologically important polymeric systems.http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-063Spring-2007/CourseHome/index.htmThomas, Edwin (Ned)2008-04-10T06:30:08-04:003.063en-USMaterials Science and EngineeringPolymer/Plastics Engineeringnanocompositeinorganicorganicmicrophase separationthermodynamicselasticrubbercrystalglasscopolymerpolymer chainsolidsolutionmeltphysicschemistryphysical chemistrytransportopticalmechanicalMIT OpenCourseWare http://ocw.mit.eduContent within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/OcwWeb/web/terms/terms/index.htmSolution of clinical problems by use of implants and other medical devices. Systematic use of cell-matrix control volumes. The role of stress analysis in the design process. Anatomic fit: shape and size of implants. Selection of biomaterials. Instrumentation for surgical implantation procedures. Preclinical testing for safety and efficacy: risk/benefit ratio assessment. Evaluation of clinical performance: design of clinical trials. Project materials drawn from orthopedic devices, soft tissue implants, artificial organs, and dental implants.http://ocw.mit.edu/OcwWeb/Mechanical-Engineering/2-782JSpring-2006/CourseHome/index.htmSpector, MyronYannas, Ioannis2008-03-20T03:50:37-04:002.782JHST.524J3.961J20.451Jen-USBiological EngineeringMechanical EngineeringbioengineeringmedicinehealthcareregulationhealthACLcartilageFDA approvalFDAjointtoothbonenerveskingeneticsscarbio-implantscaffoldprosthesisstentdental implantsartificial organssoft tissue implantsorthopedic devicesclinical trialsclinical performancerisk/benefit ratio assessmentPreclinical testingsurgical implantation proceduresbiomaterialsanatomic fitstress analysiscell-matrix control volumesmedical devicesimplantsclinical problemsMechanical EngineeringMaterials Science and EngineeringHealth Sciences and TechnologyMIT OpenCourseWare http://ocw.mit.eduContent within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/OcwWeb/web/terms/terms/index.htm